Key Features
Performance Architecture
- Based on Intel® Xeon® 6th Scalable Processors, up to 350W TDP
- 32 DIMM slots support RDIMM up to 6400MT/s , MRDIMMs up to 8000MT/s
- Support NVIDIA HGX B200 air cooling
Flexible Configuration
-
CPU to Switch flexible link band width (X16 or X32)
-
Support full high and half high NIC card
For New Data Center
-
Support front IO access
-
N+N PSU Redundant
-
High-efficiency thermal solution for power save
-
High-efficiency DC/DC solution
Technical Specifications
CPU | 2 x Intel ® Xeon 6700E/6500P/6700P Processor up to 350W |
GPU | 8 x HGX B200 air cooling |
Memory | Up to 32 DDR5 DIMM Slot, support RDIMM up to 6400MT/s , MRDIMMs up to 8000MT/s |
Storage |
|
PCIE Extension |
|
Enclosure Management |
|
Front IO |
|
Cooling |
|
Operation Temperature | 5ºC – 35ºC |
PSU |
|
Dimension | 440mm(H) x 448mm(W) x 900mm(D) |